Multi Element Array - High Speed
| PN |
No.Of Elements
|
Element Active Area
|
Dark Current
|
Pitch
|
Capacitance
|
Package
|
Pin Qty.
|
Package Style
|
Window
|
| FCI-InGaAs-4M |
4*1
|
Ø75 μm
|
0.03 nA
|
250 μm
|
0.65 pF
|
Ceramic Submount
|
|
Chip
|
-
|
| FCI-InGaAs-12M |
12*1
|
Ø75 μm
|
0.03 nA
|
250 μm
|
0.65 pF
|
Ceramic Submount
|
|
Chip
|
-
|
| FCI-InGaAs-8M |
8*1
|
Ø75 μm
|
0.03 nA
|
250 μm
|
0.65 pF
|
Ceramic Submount
|
|
Chip
|
-
|
| FCI-InGaAs-16M |
16*1
|
Ø75 μm
|
0.03 nA
|
250 μm
|
0.65 pF
|
Ceramic Submount
|
|
Chip
|
-
|
| FCI-InGaAs-300B1X4 |
4*1
|
Ø300 μm
|
0.05 nA
|
500 μm
|
8 pF
|
Ceramic Submount
|
|
Chip
|
-
|
| FCI-InGaAs-300B1X8 |
8*1
|
Ø300 μm
|
0.05 nA
|
500 μm
|
8 pF
|
Ceramic Submount
|
|
Chip
|
-
|
